Image display

ABSTRACT

A flat-type image display, such as, a plasma display, a LCD display, an OLED display, etc., in particular, for improving a cooling efficiency of a display panel, various kinds of substrates and an image display element, within the thin-sized housing thereof, comprises: a display panel; a chassis, which supports the display panel from a rear surface side thereof; a front surface-side cover, which is provided on a front side of the display panel; a rear surface-side cover, which is provided on a rear side of the display panel; an image display element connected with the display panel; a display driver substrate, which is connected with the display panel, and on a surface of which opposite to the chassis are provided circuit parts thereof; a power source substrate, which supplies driving power to the display driver substrate and the image display element, and on a surface of which opposite to the chassis are provided circuit parts thereof; and a first insulator board, which is provided at a position opposite to the display driver substrates and the power source substrate of the chassis.

BACKGROUND OF THE INVENTION

The present invention relates to an image display, and it relates to, in particular, cooling for display panels, such as, a plasma display, a LCD display, an OLED display, etc., for example, and/or various kinds of boards, and image processing elements thereof, as well.

For a flat-type image display, such as, the plasma display and the liquid crystal display, etc., high-brightness and high-definition of images or pictures are required, and accompanying that, with an increase of a number of electronic parts for use of processing of images, further heat generation of the display panel and heat generation of various kinds of substrates are also increased, and therefore cooling for such heat generating parts comes to be a problem to be dissolved.

A display for achieving dissolution of such problem accompanying with an increase of heat generation of the display panel module and the various kinds of substrates is already described in the following Patent Document 1, for example. In this Patent Document 1 is disclosed the structures for conducting the cooling of the display panel module and the various kinds of substrates through discharging heats discharged from them, with provision of a cooling fan for evacuation, which is obliquely installed on a ceiling portion of a back cover.

Also, other image display for achieving dissolution of the problem accompanying with the increase of heat generation of the display panel and the various kinds of substrates is described in the following Patent Document 2. In this Patent Document 2 is disclosed the structures for conducting the cooling of the display panel module and the various kinds of substrates, with providing a circuit parts install side-surface of a substrate on a side of the display panel.

[Patent Document 1] Japanese Patent Laying-Open No. 2005-235843 (2005); and

[Patent Document 2] Japanese Patent Laying-Open No. 2001-22281 (2001).

BRIEF SUMMARY OF THE INVENTION

For the image displays of the recent years, in combination with the high-brightness and the high-definition of pictures, demand is increased for thin-sizing thereof. In particular, for achieving high-quality design, as well as, achieving an easiness of an on-wall setting thereof, i.e., handing the image display on a wall for the purpose of viewing/listening thereof, it is necessary to achieve further thin-sizing and light-weighting, comparing to the existing thin-type image display.

For achieving the thin-sizing of the image display, it is necessary to reduce the thickness (i.e., thin-sizing) of a space on a rear surface, which occupies the most of sizes in depth thereof. With this thin-sizing of the rear surface, in combination with the thin-sizing of the various kinds of substrates and/or members to be installed, it is necessary to reduce the distances defined between the various kinds of substrates and a base chassis for supporting the display panel thereon, and also the distance defined between the various kinds of substrates and the cover on the side of the rear surface.

In case of dosing this, an airflow conviction, formed in the distance between the various kinds of substrates and the chassis and/or a gap portion therebetween, comes to be small, therefore, there is a problem that heat radiation of the display panel through the chassis is lowered down at that portion. Further, because the distance between the substrates and the chassis comes to be small, there is generated a case that the distance cannot be maintained necessary for obtaining an insulation between circuits parts, which are installed on the substrates and the chassis. In this case, there is generated a necessity of installing an insulator member, newly, between the substrates and the chassis. The structure of installing a plate-like insulator board as the insulator member is easy, from a structural viewpoint. However, the insulator board having thermo conductivity of around 0.1 to 1 (W/m·K) is greatly low, comparing to the thermo conductivity of the chassis, which is made of a metal material, such as, an iron alloy or an aluminum alloy, etc., in many cases, having the thermal conductivity of around 30 to 200 (W/m·K). For this reason, the insulator board on the base chassis prevents a flow of heat dissipation into an air within an inside of the image display, from the display panel through the chassis, then there is brought about a problem that an efficiency of heat radiation or dissipation of the display panel is further reduced, in particular, via the chassis in the portion where the insulator board is provided.

Also, within the image display of the conventional art, as is disclosed in the Patent Document 1, such a structure is adopted, in many cases, for achieving the cooling by accelerating ventilation within the apparatus, with providing a relatively large-sized axial fan on an upper portion of the back cover on the rear surface thereof. However, in case when trying to thin the size in depth of the image display, as a whole, from around 100 mm of the conventional art down to around 35 mm, for example, a suction surface of the axial fan comes close to the chassis, i.e., approximately 10 mm, and an exhaust surface thereof also comes close to the cover on the non-display side of the display. For this reason, both the suction surface and the exhaust surface come close to obstructions, respectively, then resistance in the ventilation is increased and the a flow rate is greatly reduced; therefore, there is a problem that the efficiency is lowered down in cooling of the display panel. The flow rate can be increased if increasing the rotating speed of the axial fan, but there is other problem that fan noises is increased.

Also, with the image displays, advancement is achieved on the high-brightness and the high-definition of images, every year, and accompanying with this, the number of the electronic parts for use of image processing has a tendency of increasing. In particular, there is a case of adopting such structures therein, i.e., also disposing image display elements in an upper end portion of the display panel, in addition to a lower end portion thereof, so as to deal with the high-definition. In this case, since the display panel is heated from a lower side thereof, gradually, and since the axial fan is located on an upper side of the display panel where the air rising up temperature thereof can be easily accumulated, then with the structures disclosed in the Patent Document 1, the heat radiation or dissipation comes to be short, and therefore there is a possibility that the temperature of parts exceed an upper limit value thereof. For compensating or supplementing the shortage of cooling for the image display elements in the upper endportion of the displaypanel, it is possible to dispose all of the image display elements in the lower end portion of the display panel. However, in case when disposing the image display elements in this manner, there is also a problem that the temperatures of the image display elements and the display panel in the vicinity thereof are increased, if an image of increasing the heat generation of the image display elements continues for a long time-period.

Also, within the image display of the conventional art, in many cases, for the purpose of an improvement of heat radiation or dissipation due to accelerating suction/exhaustion of the air from/into an outside of the apparatus, an opening(s) is/are provided in a middle portion thereof, not only the upper side and the lower side of the rear surface cover. However, if providing the opening(s) in the middle portion of the rear surface cover, there are problems that the design quality or characteristic of the apparatus is lowered down, and that it is difficult to block or shield propagation of the sound noises of the fan inside the apparatus and electromagnetic noises from a substrate for power source into an outside thereof.

According to the present invention, an object thereof is to provide an image display for increasing or improving the cooling efficiency of the display panel, various kinds of substrates, and/or image display elements of within the thin-sized image display, but without accompanying an increase of noises of a fan.

For accomplishing the object mentioned above, according to the present invention, there is provided an image display, comprising: a display panel; a chassis, which supports said display panel from a rear surface side thereof; a front surface-side cover, which is provided on a front side of said display panel; a rear surface-side cover, which is provided on a rear side of said display panel; an image display element connected with said display panel; a display driver substrate, which is connected with said display panel, and on a surface of which opposite to said chassis are provided circuit parts thereof; a power source substrate, which supplies driving power to said display driver substrate and said image display element, and on a surface of which opposite to said chassis are provided circuit parts thereof; and a first insulator board, which is provided at a position opposite to said display driver substrates and said power source substrate of said chassis.

According to the present invention, it is possible to cool the heat generation parts, such as, a display panel, display driver substrates, and a image display element, etc., with stability, while suppressing noises into an outside of the apparatus, and also to maintain electrical insulation among circuit parts, a chassis, and a non-display side cover. Accordingly, it is possible to provide an image display, having high-brightness and high-definition, as well as, high reliability, and also easy in a wall hanging-on installation and high in design quality thereof.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

Those and other objects, features and advantages of the present invention will become more readily apparent from the following detailed description when taken in conjunction with the accompanying drawings wherein:

FIG. 1 is a rear side open-up view for showing the principle portions of an image display, according to an embodiment 1 of the present invention;

FIG. 2 is an A-A cross-section view of the image display, seeing from a side surface in FIG. 1;

FIG. 3 is an outlook view of a rear surface side of the image display shown in FIG. 1;

FIG. 4 is a view for showing a cover of the image display on the rear-surface side, seeing it from an inside of a housing shown in FIG. 1;

FIG. 5 is a B-B cross-section view for showing the image display shown in FIG. 2, seeing it from a rear surface thereof;

FIG. 6 is a C-C cross-section view for showing the image display shown in FIG. 5;

FIG. 7 is a cross-section view of the conventional structure of the image display, corresponding to the A-A cross-section in FIG. 1;

FIG. 8 is a rear surface view of the image display of the conventional structure;

FIG. 9 is a view for showing distribution of temperatures on a front surface of a display panel of the conventional structure;

FIG. 10 is a cross-section view of a centrifugal fan;

FIG. 11 is a cross-section view of a sirocco fan, seeing it on a D-D cross section in FIG. 10;

FIG. 12 is a cross-section view of a turbo fan, seeing it to on the D-D cross section in FIG. 10;

FIG. 13 is a cross-section view of another centrifugal fan;

FIG. 14 is a view for showing distribution of temperatures on a front surface of a display panel of the structure according to the embodiment 1;

FIG. 15 is a rear side open-up view for showing the principle portions of an image display, according to an embodiment 2 of the present invention;

FIG. 16 is a F-F cross-section view of the image display, seeing it from a side surface in FIG. 15;

FIG. 17 is a rear side open-up view for showing the principle portions of an image display, according to an embodiment 3 of the present invention;

FIG. 18 is a H-H cross-section view of the image display, seeing it from a side surface in FIG. 17; and

FIG. 19 is a cross-section view of the image display, according to an embodiment 4 of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, explanation will be made on an embodiment 1, by referring to the FIGS. 1 to 13 attached herewith. FIG. 1 is a rear side open-up view for showing the principle portions of an image display, according to an embodiment 1 of the present invention. FIG. 2 is an A-A cross-section view of the image display, seeing from a side surface in FIG. 1. FIG. 3 is an outlook view of a rear surface side of the image display shown in FIG. 1. FIG. 4 is a view for showing a cover of the image display on the rear-surface side, seeing it from an inside of a housing shown in FIG. 1. FIG. 5 is a B-B cross-section view for showing the image display shown in FIG. 2, seeing it from a rear surface thereof. FIG. 6 is a C-C cross-section view for showing the image display shown in FIG. 5. FIG. 7 is a cross-section view of the conventional structure of the image display, corresponding to the A-A cross-section in FIG. 1. FIG. 8 is a rear surface view of the image display of the conventional structure. FIG. 9 is a view for showing distribution of temperatures on a front surface of a display panel of the conventional structure. FIG. 10 is a cross-section view of a centrifugal fan. FIG. 11 is a cross-section view of a sirocco fan, seeing it on a D-D cross section in FIG. 10. FIG. 12 is a cross-section view of a turbo fan, seeing it on the D-D cross section in FIG. 10. And, FIG. 13 is a cross-section view of another centrifugal fan.

In those FIGS. 1 to 13, a reference numeral 1 depicts a display panel, 2 a display driver substrate, 3 a flexible cable, 4 a chassis, 5 a fixed substrate, 6 an image display element, 6 a an image display element provided on an upper end portion of the display panel 1, 7 a first heat sink of the image display element 6, 8 a power source substrate, 9 a cable, 10 a controller unit, 11 a fan, 12 a front surface-side cover (or, a display surface-side cover), 13 a rear surface-side cover (or, a non-display surface-side cover), 14 an installation tool, 15 an opening portion of the rear surface-side cover 13, 15 a an upper opening, 15 b a lower opening, 15 c a bottom opening, 15 d a middle opening, 16 a first insulator board, 17 a second insulator board, 18 a circuit part, 19 an axial fan, 20 a case, 21 a motor, 22 an impeller, 23 a suction opening, and 24 a blow-off opening, respectively. Hereinafter, the same reference numerals are attached to those having the same function, and the explanation thereof will be omitted herein.

Within the image display, a surface, upon which an image on the display panel 1 shown in FIG. 2 is displayed, corresponds to a front surface (or, a front side), and a reverse side of the display panel module 1, on which the display driver substrate 2, etc., are provided, a rear surface (or, a rear side), respectively. Hereinafter, for convenience of explanation, the left and right direction is defined by a direction when seeing the image display from a front side thereof, and the up and down direction is defined by an up and down under the condition where the image display is installed, as is shown in FIG. 2.

As is shown in FIG. 1, at an end of the display panel 1 is provided a flexible cable 3, for supplying a video signal and driving electric power thereto. The flexible cable 3 may be provided on the left and right end surfaces and a lower end surface of the display panel 1, in many cases. In FIG. 1 is shown a case where a flexible cable 3 a is provided on the left-side end surface, a flexible cable 3 b is provided on the right-side end surface, and a flexible cable 3 c is provided on the lower end surface. The flexible cables 3 a, 3 b and 3 c are connected on the display driver substrates 2 a and 2 b and the fixed substrate 5, respectively, which are provided on the chassis 4 connected on the rear surface of the display panel 1, under the condition of being turned up in “U”-like shape. For transferring the video signal and the electric power to all of the pixels of the display panel 1 in the vertical and the horizontal directions thereof, the flexible cables 3 are so provided that they cover almost the side surfaces and the lower surfaces of the display panel 1. With the flexible cable 3 c at the lower side-end surface are provided a plural number of image display elements 6. The image display elements 6, because of cases where heat generation thereof comes to be large depending on an image displayed, are connected with the first heat sink 7, to be cooled. To the image display element 6 on the lower end side of the display panel 1 and the display driver substrates 2 a and 2 b are supplied, through the cable 9, the electric power from the power source substrate 8, for regulating voltage of electric power from an external power source not shown in the figure, and the video signal inputted from the controller unit 10. Although showing an example of using the power source substrate being formed as one (1) piece of substrate, in FIG. 1; however, there may be applied power source substrate, having structure of being made up with a plural number of substrates, and to be connected with cables to function. On the display driver substrates 2 a and 2 b and the power source substrate 8 are mounted the circuit parts 18. FIG. 5 shows an example where on the display driver substrate 2 a are mounted an IC 18 a, a second heat sink 18 b, a capacitor 18 c and a coil 18 d, and on the display driver substrate 2 b are mounted ICs 18 e and 18 f, second heat sinks 18 g and 18 h, a capacitor 18 i and a coil 18 j, and further on the power source substrate 8 are mounted an IC 18 k, a second heat sink 18 l, a transformer 18 m, a capacitor 18 n, a coil 18 o. As the second heat sinks 18 b, 18 g, 18 h and 18 l on the substrates may be applied one of expanding an area thereof in a comb-like manner, as is shown in the cross-section view of FIG. 6, for example, for increasing or improving the characteristic of heat radiation or dissipation thereof.

Within the housing are also stored the fans 11, etc., other than those. FIG. 1 shows a case of installing one (1) set of fan 11 a under the display driver substrate 2 a, one (1) set of fan 11 b under the display driver substrate 2 b, and two (2) sets of fans 11 c and 11 d under the power source substrate 8, respectively. The number of the fans 11 under the display driver substrates 2 a and 2 b and the power source substrate 8 may be increased than that shown in FIG. 1 in each area. Also, alternately, depending upon an area, the fan corresponding to the fan 11 a may not be provided, for example. As the fan 11, a centrifugal fan is applied. Herein, the centrifugal fan is a sirocco fan or a turbo fan. The centrifugal fan 11 comprises, as is shown in FIG. 10, the case 20, the motor 21, the impeller 22, being apart formed with the motor as a unit, wherein an air sucked from the suction opening 23 is blown out from the blow-off opening 24, which is formed in the direction perpendicular to the suction surface, utilizing a centrifugal effect due to rotation of the impeller 22. Within the sirocco fan 11, a large number of blades 25 for building up the impeller 22 are so formed that, as is shown in FIG. 11, an inclination of the blades comes to direct into the rotation direction of the impeller 22 on an outer periphery thereof. Within the turbo fan, a large number of blades 25 for building up the impeller 22 are so formed that, as is shown in FIG. 12, an inclination of the blades comes to direct into the direction opposite to the rotation direction of the impeller 22 on an outer periphery thereof. Though illustrating the case where the suction opening 23 of the centrifugal fan 11 is only one (1) piece, in FIG. 10, however the suction opening 23 may be provided on both sides, as indicated by 23 a and 23 b in FIG. 13.

As is shown in FIG. 2, the housing of the image display covers the display panel 1 and various equipments by the front surface-side cover 12 and the rear surface-side cover 13 from an outside thereof, and is installed or attached with the installation tool 14. On the rear surface-side cover 13 are provided a plural number of openings 15, and as is shown in FIGS. 2 and 3, there are provided the upper opening 15 a, the lower opening 15 b, and the bottom opening 15 c. Though not showing detailed configuration of the openings in the figure, but they may be made up with a porous plate or a slit, or a mesh, etc., for example. Those shown by broken lines in FIG. 3 depict the positions where the fans 11 are installed inside the housing.

Further, as is shown in FIGS. 1 and 2, the display driver substrates 2 a and 2 b and the power source substrate 8 are installed, and on a surface of the chassis 4 are provided first insulator boards 16 made of a material having an electrical insulation characteristic, at the positions where those substrates oppose thereto. Those first insulator boards 16 are provided, i.e., 16 a for the display driver substrate 2 a, 16 b for the display driver substrate 2 b, and 16 c for the power source substrate 8, respectively. Also, as is shown in FIGS. 1 and 4, on the surface of the rear surface-side cover 13 of that position, and at the positions where it opposes to the display driver substrates 2 a and 2 b and the power source substrate 8 are provided the second insulator boards 17 made of a material having an electrical insulation characteristic. Those second insulator boards 17 are provided, i.e., 17 a for the display driver substrate 2 a, 17 b for the display driver substrate 2 b, and 17 c for the power source substrate 8, respectively. Broken lines shown on the second insulator boards 17 a, 17 b and 17 c in FIG. 4 indicate the positions of the display driver substrates 2 a and 2 b and the power source substrate 8, which are provided opposite thereto respectively, and they are provided cover areas being approximately equal to that of those substrates, or larger than that.

Herein, an example of the structure of the image display, having the conventional structures, by referring to FIGS. 7 and 8. The conventional structure has a size “D” of about 100 mm in depth thereof. It installs the substrates, such as, the display driver substrate 2 a and so on, mounting the circuit parts thereon, for example, separating from the chassis 4 at a distance “L1” of approximately 10 to 15 mm, and at a distance “L2” of approximately 10 to 15 mm between a part of the circuit parts 18 closest to the rear surface-side cover 13 and that rear surface-side cover 13, and has the image display element 6 and the first heat sink 7 at the lower end of the display panel 1. Also, it has other image display element 6 a at the upper end of the display panel, and through the flexible cable 3 d is carried out control of the display image from both the upper and lower sides thereof. For this reason, since the heat sources are disposed separating from each other, i.e., at the upper and the lower ends of the display panel 1, it is easy to suppress an increase of temperature, if heat generation of the image display elements 6 and 6 a rises up. Also, since the side in depth is about 100 mm, it is possible to maintain the distance “L3” to be around 30 mm to 50 mm separating from the chassis 4, even if the axial fans 19 a, 19 b and 19 c, having thickness of about 20 mm, are installed therein, as is shown in FIG. 7. For this reason, it is possible to obtain a relatively large flow rate with practically using the characteristics of the axial fan, i.e., a large flow rate can be obtained, easily. With provision of the axial fans 19 d and 19 e having an outer diameter “L4” of about 60 mm, in periphery of the display driver substrates 2 and the power source substrate 8, as is shown in FIGS. 7 and 8, there may be a case of cooling those substrates, locally. Also, with provision of an opening 15 d, too, at a middle of the rear surface-side cover 13, as is shown in FIGS. 7 and 8, ventilation is accelerated within the housing. In an upper portion of the display panel 1, since the heat generating from the display driver substrates 2 a and 2 b and the power source substrate 8, etc., goes up, due to the natural or free convection, to be accumulated, then the temperature thereof can easily rise up. However, with mounting the large-sized axial fans 19 a, 19 b and 19 c, having a large flow rate, and easiness of sucking of the air with large-sizing of the middle opening 15 d and the low opening 15 b of the rear surface-side cover 13, the image display element 6 a and the display panel 1 can operate at the temperature of the upper limit or lower than that.

By the way, when thinning the size “D” of the housing in the depth thereof, up to 35 mm, for example, then as a result of the studies made by the present inventors and so on, there comes out a necessity of reducing the distance “L1” between the chassis 4 and the display driver substrates 2 a and 2 b and the power source substrate 8 down to about 5 mm, if thin-sizing the display driver substrates 2 a and 2 b and the power source substrate 8, replacing the various kinds of circuit parts on the substrates by thin-sized parts, within the apparatus shown in FIG. 7. There also comes out a necessity of reducing the distance “L2” between the rear surface-side cover 13 and the display driver substrates 2 a and 2 b and the power source substrate 8, down to about 5 mm. And, if the distance between the display driver substrates 2 a and 2 b and the power source substrate 8 and the chassis 4, and the rear surface-side cover 13, comes to be small, down to about 5 mm, then from a viewpoint of electric safety, there comes out another necessity of further inserting an insulator boards into narrowed gaps, which are defined between both of those.

When bringing the distance “L1” between the chassis 4 and the display driver substrates 2 a and 2 b and the power source substrate 8, to be small down to about 5 mm, then temperature distribution on the front surface of the display panel comes to be as shown in FIG. 9, showing a result of experiments diagrammatically, and temperature of the display panel 4 rises up, in particular, at the position where the display driver substrates 2 a and 2 b and the power source substrate 8 are mounted on the chassis. This is because, due to shrinking of the distance “L1” between those substrates and the chassis 4, the ventilation into a space of the gaps is reduced, remarkably, and therefore, heat generating on the display panel 1 cannot be radiated or dissipated, easily, even if it is transferred to the chassis 4, which is connected with the display panel 1, through thermal conductivity, since the thermal conductivity due to the conviction from the chassis 4 to the air is reduced, greatly, comparing to the conventional structures. According to the result of the studies made by the present inventions, it is confirmed that an increase of temperature on the display panel 1, corresponding to the positions where the substrates are provided, can be reduced, greatly, if keeping the gap distance “L1” to be equal or greater than 10 mm, approximately, through the experiments. Also, as is shown in FIG. 1, the first insulator boards 16 a, 16 b and 16 c are provided on the surface of the chassis 4, at the positions where the display driver substrates 2 a and 2 b and the power source substrate 8 oppose thereto, from the viewpoint of electric safety. In this case, the insulator boards made of a resin material, being low in the thermal conductivity thereof, i.e., about 0.1 to 1 (W/m·K) is greatly small in the thermal conductivity than the metal made chassis 4 having the thermal conductivity of about 30 to 200 (W/m·K), then they buildup thermal resistance on the surface of the chassis, at the positions where the first insulator boards 16 a, 16 b and 16 c are provided, and they bring about an adiabatic effect, comparing to other position where no such first insulator board is provided, and also an increase of temperature. As a result of measurement in the experiments made by the present inventors, with provision of the first insulator boards 16 on the chassis 4, the temperature of the display panels 1 rises up about 2K, at the position corresponding to that provision thereof.

Further, within the conventional structure shown in FIG. 7, it is easy to install the large-sized axial fans 19 a, 19 b and 19 c, with which a large flow rate can be obtained easily. However, since those fans has the thickness of about 20 mm, if thin-sizing the size “D” of the housing in the depth down to about 35 mm, then the distance “L3” between the suction surface of the fan and the chassis 4 can be maintained only to be about 10 to 15 mm, at the most, if changing the axial fan by a thin-type fan having thickness of about 10 to 15 mm. For this reason, for the axial fans 19 a, 19 b and 19 c, the ventilation resistance is increased, greatly, on the suction side, and therefore a working flow rate is lowered down. As a result of measurement in the experiments made by the present inventors, it is confirmed that the flow rate of the axial fans 19 is reduced, greatly, comparing to that of the conventional structure, when the gap distance “L3” is narrowed to be equal or less than 20 mm. With the small-sized axial fans 19 d and 19 e, which are provided in the periphery of the display driver substrates 2 a and 2 b and the power source substrate 8, the flow rate is obtained with using one having the outer diameter “L4” of about 60 mm, in the conventional structure. However, when thinning the size “D” in the depth thereof down to about 35 mm, for example, then it is possible to install therein, only a fan having the outer diameter “L4” of about 20 mm. For this reason, there are drawbacks that the flow rate is reduced greatly, and that the noises of the fans go up abruptly if trying to obtain that flow rate by increasing the rotating speed thereof. Also, since the middle opening 15 d and the lower opening 15 b of the rear surface-side cover 13, having the relatively large openings, are positioned in the periphery of the display driver substrates 2 a and 2 b and the power source substrate 8, there is also a drawback that the noises of the fans propagate to an outside of the housing, easily.

Herein, in the embodiment 1, as is shown in FIGS. 2 and 6, the display driver substrates 2 a and 2 b and the power source substrate 8 are installed in such direction that the circuit parts 18 on the display driver substrates 2 a and 2 b and the power source substrate 8 oppose to the chassis 4. The centrifugal fans 11 a, 11 b, 11 c and 11 d, directing the blow-off openings up in FIG. 2, are provided on the lower side of the display driver substrates 2 a and 2 b and the power source substrate 8. And, those centrifugal fans 11 a, 11 b, 11 c and 11 d ventilate the air into the gaps where the chassis 4 opposes to the display driver substrates 2 a and 2 b and the power source substrate 8. A gap distance “L5” between the main suction surfaces of the centrifugal fans 11 a, 11 b, 11 c and 11 d and the rear surface-side cover 13 comes to 10 to 15 mm, approximately. In case of the centrifugal fan, since the gap distance between the suction surface and the obstacle does not influence the flow rate, remarkably, as in the axial fan, then it is possible to maintain an appropriate flow rate. Also, with the axial fan of the conventional structure, since the perforated plate is provided on the upper opening 15 a in vicinity of the exhaustion side, as is shown in FIG. 7, this comes to be the ventilation resistance, and thereby bringing about lowering of the flow rate. However, with the centrifugal fan, since the air from the exhaust surface flows naturally into an upper direction in FIG. 2, along with the chassis 4, but without colliding directly upon the chassis 4, since it is bent 90° within the fan, from the suction side to the exhaust side, the ventilation resistance is lowered down, in particular, on the exhaust side, and therefore it is easy to maintain the flow rate necessary for cooling.

Air suctions of the centrifugal fans 11 a, 11 b, 11 c and 11 d are conducted, mainly, from the lower opening 15 b and the bottom opening 15 c of the rear surface-side cover 13. Conventionally, as is shown in FIG. 7, since it is provided on the upper end of the display panel 1, it is difficult to cool the image display elements 6. On the contrary to this, with the embodiment 1, since the image display elements 6 are integrated on the lower end of the display panel 1, it is necessary to cool the image display elements 6 with an enough margin thereof.

In the embodiment 1, the lower opening 15 b of the rear surface-side cover 13 is provided at the position facing to the first heat sink 7 of the image display elements 6. The height “H1” of the upper-side position of the lower opening 15 b of the rear surface-side cover 13 is determined to be smaller than the height “H3” of the upper-side position of the first heat sink 7, or within 5 mm if being higher than the upper-side position of the first heat sink 7. Also, the height “H2” of the lower-side position of the lower opening 15 b of the rear surface-side cover 13 is determined to be equal to the height “H5” of the middle position of the first heat sink 7 in the vertical direction, or to be smaller than that. With thin-sizing of the housing, an area of the bottom opening 15 c comes to be small, and the lower opening 15 b, i.e., the opening in vicinity of the centrifugal fan 11, is a main opening. However, because of adoption of the structure mentioned above, since the air passes through the first heat sink 7 of the image display elements 6, with certainty, when it passes through the lower opening 15 b, therefore it is possible to cool the image display elements 6, with stability.

Also, with the structure shown in FIG. 8, the lower opening 15 b, in particular, the height “H1” of the upper-side position of the lower opening 15 b is provided at the position, being higher than the height “H3” of the upper-side position of the first heat sink 5 by 40 to 50 mm. In this case, the air does not pass through the first heat sink 7, but since almost of the air is sucked to the axial fan 19 while passing through the opening on an upper side of the first heat sink 7, then there is a problem that the cooling efficiency of the image display elements 6 is lowered down. However, with the structure according to the embodiment 1, such problem will be dissolved. As a result of confirmation through the experiments, which are made upon the embodiment 1, by the present inventors, there can be obtained an effect of lowering down the temperature of the image display elements 6 by about 5K. Also, the lower opening 15 b is provided below the centrifugal fan 11. With this, the suction surface of the centrifugal fan 11 is so provided that it faces to the rear surface-side cover 13. For this reason, noises propagating from an inside of the centrifugal fan 11 through the suction face are shut off, by the rear surface-side cover 13, and they do not propagate to the outside of the housing, directly, but they propagate from the lower opening 15 b and the upper opening 15 a positioned separately, therefore there can also be obtained an effect of suppressing the noises of the fans, in the outside of the housing, at the same time.

Also, in case when thin-sizing the conventional structure shown in FIG. 7 as it is, then the gap distance “L1” between the display driver substrates 2 a and 2 b and the power source substrate 8 comes to 5 mm, i.e., it is impossible to let the air to ventilate therethrough. However, according to the structure of the embodiment 1, as is shown in FIG. 2, with installation of the circuit parts 18 of the display driver substrates 2 a and 2 b and the power source substrate 8 into the direction facing to the chassis 4, it is possible to enlarge the distance “L1” between the chassis 4 and the substrates 2 and 8 to 15 to 20 mm, approximately. With this structure, since the air is sucked from the lower side of the display driver substrates 2 a and 2 b and the power source substrate 8, to be ventilated into the upper direction, by the centrifugal fan 11, the air is ventilated through the chassis 4 to the display panel 1 and the circuit parts 18, at the same time, then it is possible to achieve thin-size of the apparatus, as well as, an improvement of the cooling efficiency of those parts. For this reason, the first insulator board 16 is provided on the chassis 4 opposite to the display driver substrates 2 a and 2 b and the power source substrate 8, and because of the adiabatic effect due to the first insulator board 16, it is possible to cool the display panel 1 and the circuit parts 18, at a level of maintaining the reliability thereof, even when the temperature rises up by 1 to 2K on the display panel 1 corresponding to the portion where the first insulator board 16 is provided. As a result of measurement of temperature, made by the present inventors, under the condition of installing the display driver substrates 2 a and 2 b and the power source substrate 8, so that the circuit parts thereof are provided on the side of the rear surface-side cover 13, upon basis of the structure shown in FIG. 2, there can be obtained an effect of lowering the temperature by 7 to 10K on the front surface of the display panel 1.

The structure of the embodiment 1 is, as is shown in FIG. 2, that for cooling the display driver substrates 2 a and 2 b and the power source substrate 8, and also the display panel 1, efficiently, with using the centrifugal fan 11. For this reason, there is no need of additionally cooling of the circuit parts 18 on the display driver substrates 2 a and 2 b and the power source substrate 8, with provision of the middle opening on the rear surface-side cover 13, like the conventional structure shown in FIG. 8. Also, the second insulator boards 17 a, 17 b and 17 c are provided between the display driver substrates 2 a and 2 b and the power source substrate 8 and the rear surface-side cover 13, for the purpose of the electrical safety, and therefore, the middle opening 15 d will not function as a ventilation opening, substantially, even if it is provided on the rear surface-side cover 13. Accordingly, with adoption of the embodiment 1, a number of the openings is small when seeing it from the rear side thereof, and therefore it is possible to provided an image display being superior in the designing thereof. Also, with the conventional structure shown in FIG. 7 or 8, it has the structure of propagating electromagnetic noises generated from the display driver substrates 2 a and 2 b and the power source substrate 8, easily, as they are, into the outside of the housing. However, with the structure according to the embodiment 1, since the circuit parts 18 as the noise sources are provided on the side of the chassis 4, and are covered by the display driver substrates 2 a and 2 b and the power source substrate 8, there is no middle opening 15 d, which was a main opening for propagating the electromagnetic noises from the rear surface-side cover 13. With such structure, there can be obtained an effect of suppressing the propagation of noises from the circuit parts 18 to the outside of the housing, in addition to the above.

Explanation will be made on an embodiment 2, by referring to FIGS. 14 to 16. FIG. 14 is a view for showing distribution of temperatures on a front surface of a display panel of the structure according to the embodiment 1. FIG. 15 is a rear side open-up view for showing the principle portions of an image display, according to an embodiment 2 of the present invention. FIG. 16 is a F-F cross-section view of the image display, seeing it from a side surface in FIG. 15. However, sizes of the display driver substrates 2 a and 2 b and the power source substrate 8 are shown by broken lines in FIG. 15.

With the embodiment 2, as shown in FIGS. 15 and 16, among the circuit parts installed on the display driver substrates 2 a and 2 b, first insulator boards 16 d, 16 e and 16 f are provided at the positions opposite to the positions of installing the circuit parts, each having height at least equal or greater than 50% of the height “H5” from the display driver substrates 2 a and 2 b (i.e., at least equal or greater than 50% with respect to the distance from the display driver substrate 2 up to the chassis 4).

FIG. 14 is the view for showing distribution of temperatures on the front surface of the display panel 1, corresponding to the structure according to the embodiment 1. Comparing to FIG. 9 of the result of the structure, which is thin-sized following the conventional structure, accompanying with changes in the structures of the fan 11 and the lower opening 15 b, and the structure for installing the display driver substrates 2 a and 2 b and the power source substrate 8, the temperature on the front surface of the display panel 1 is reduced, greatly. However, there is a problem that the temperatures come to be high, locally, at the positions, such as, of the second heat sinks 18 b, 18 g and 18 h, etc., being high in the height “H2” from the substrate, among the circuit parts 18 on the display driver substrates 2 a and 2 b and the power source substrate 8. This is because, as is shown in FIG. 6, at the positions of the second heat sinks 18 b, 18 g and 18 h, etc., being high in the height “H2” from the substrate, an area of a cross-section is reduced, in a flow passage for the air, which is defined between the chassis 4, and the ventilation at this portion comes down to be small, locally. Further, it is also because the second heat sinks 18 b, 18 g and 18 h, temperatures of which are increased due to heat generations of the ICs 18 a, 18 e and 18 f, come close to the chassis 4. As countermeasures for that can be considered the followings, i.e., an improvement is made on the thermal conductivity on the side of the chassis 4, and also changing is made on the structures of the second heat sinks 18 b, 18 g and 18 h, etc. With the structure according to the embodiment 2, an improvement is made on the thermal conductivity on the side of the chassis 4.

With the display driver substrates 2 a and 2 b, from a viewpoint of voltage of the driving circuits thereof, the level of electrical safety is not high, comparing to that of the power source substrate 8. For this reason, it is not always necessary to provide the first insulation members 16 a and 16 b covering all over the area opposite to the display driver substrates 2 a and 2 b, the first insulation members may be provided as 18 b, 18 g and 18 h, only on the chassis 4 at the areas opposite to the parts, the height “H2” from the substrate is high, among the circuit parts. With such structure mentioned above, while maintaining the electrical reliabilities thereof, but regarding the heat radiation or dissipation transferring from the display panel 1 to the chassis 4 through the thermal conductivity and dissipating into the housing, although the heat dissipation is prevented by the adiabatic effect due to the first insulation members 16 a and 16 b having wide areas, however since surface areas are increased on the chassis 4, where no such first insulation members 16 a and 16 b exist, then the heat dissipation from the chassis 4 to the air within the housing is accelerated. For this reason, averaged temperature of the display panel 1 at the portions opposite to the display driver substrates 2 a and 2 b is lowed down, and therefore it is possible to reduce the temperatures at the positions opposite to the second heat sinks 18 b, 18 g and 18 h, etc., where the temperature is locally high. As a result of confirmation through the experiments, which are made upon the structure mentioned above, by the present inventors, there can be obtained an effect of lowering down the temperature of the display panel 1, by about 1K.

Explanation will be made on an embodiment 3, by referring to FIGS. 17 and 18. FIG. 17 is a rear side open-up view for showing the principle portions of an image display, according to the embodiment 3 of the present invention, and is showing a G-G cross-section of FIG. 18. FIG. 18 is a H-H cross-section seeing the H-H cross-section from a side surface.

In FIGS. 17 and 18, reference numerals 26 a, 26 b ad 26 c depict plate-like members, being made of high thermal conductivity, and in particular, a material having the thermal conductivity higher than the thermal conductivity of the chassis 4, in the direction of in-plane thereof. Though the chassis 4 is made of a metal member, such as, an iron alloy or an aluminum alloy, etc., in many cases, having the thermal conductivity of around 30 to 200 (W/m·K), however it is possible to obtain the thermal conductivity of 400 to 700 (W/m·K) in the in-plane direction thereof, if applying a graphite sheet, which is obtained by processing graphite into the sheet-like shape.

The embodiment 3 has the structure of connecting the members 26 a, 26 b ad 26 c of high thermal conductivity, between the insulator boards 16 a, 16 b and 16 c, which are provided on the chassis 4, at portions corresponding to the positions opposite to the display driver substrates 2 a and 2 b, or the power source substrate 8, and the chassis 4. Thus, it is the structure of comprising the members, which are provided between the first insulator boards 16 a, 16 b and 16 c and the chassis 4 and are high in the thermal conductivity in the in-plane direction thereof.

With such structure as was mentioned above, as well as maintaining the electric reliabilities thereof, but regarding the heat radiation or dissipation transferring from the display panel 1 to the chassis 4 through the thermal conductivity and dissipating into the housing, although such temperature distribution is generated as is shown in FIG. 14, because of being prevented by the adiabatic effect due to the first insulation members 16 a and 16 b having wide areas, however the members 26 a, 26 b and 26 c of high thermal conductivity dissipate the heat into wide regions in the in-plane direction. For this reason, it is possible to reduce the temperatures at the positions opposite to the second heat sinks 18 b, 18 g and 18 h, being locally high in temperature thereof. Further, since it is possible to maintain the sizes of the first insulator boards 16 as they are, there can be obtain an advantage that it can be also applied onto the chassis 4 opposite to the power source substrate 8. As a result of confirmation through the experiments, which are made upon the structure mentioned above, by the present inventors, there can be obtained an effect of lowering down the temperature of the display panel 1, by about 1 to 1.5K.

By referring to FIG. 19, explanation will be made on an embodiment 4. FIG. 19 is the cross-section view of the image display according to the embodiment 4, for showing the structure thereof at C-C cutting position in FIG. 5.

In the embodiment 4, there are also provided second heat sinks 18 b, 18 g, 18 h and 18 l, being connected with an element within the circuit parts, which are mounted on the power source substrate 8 plate-like, and being plate-like in the shape thereof. Also, the height “H3” of the second heat sink in the direction towards the chassis 4 is lower than the height of the circuit parts mounted on the power source substrate 8 in the direction towards the chassis 4. A plane portion of the second heat sink is disposed nearly in parallel with the surface of the chassis 4.

In FIG. 6 showing the embodiment 1, since fin portions of the second heat sinks 18 b, 18 g, 18 h and 18 l come close to the chassis 4, the cross-section area of the flow passage is reduced, and then the ventilation is reduced in the portion of the second heat sinks 18 b, 18 g, 18 h and 18 l. However, with the embodiment 4, as is shown in FIG. 19, since the second heat sinks 18 b, 18 g, 18 h and 18 l are plate-like in the shape thereof, but without the fin portions, or the height “H3” thereof is equal or lower than height “H4” of the IC circuit 18 e if they have the fins projecting from the plate, then the cross-section of the flow passage is expanded, thereby hardly preventing the ventilation, and with an increase of the flow rate, cooling of the display panel 1 is accelerated on the portions opposite to the second heat sinks 18 b, 18 g, 18 h and 18 l. As a result of confirmation through the experiments, which are made upon the structure mentioned above, by the present inventors, there can be obtained an effect of lowering down the temperature of the display panel 1, by about 4 to 6K.

In general, in the cooling thereof, it can be considered that an increase of the area for heat transfer on the second heat sinks 18 contributes an acceleration of cooling. However, in case of the thin-type of image display, being equal or less than 35 mm in the depth of the housing, because of the structure of the parts installed therein, the ventilation is prevented, greatly, if the cross-section area of the flow passage is narrowed to be small, and therefore there may be a case where the cooling efficiency can be improved by adapting the structure of maintaining the ventilation flow rate, rather than maintaining the heat transfer area.

However, including those embodiments 1 through 4, the explanation was made in details thereof, with using an example of the structure of the plasma display, but it is needless to say that the present invention is also applicable into other large-sized flat-type image displays, such as, a LCD display, an OLED display, etc., for example.

The present invention may be embodied in other specific forms without departing from the spirit or essential feature or characteristics thereof. The present embodiment(s) is/are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the forgoing description and range of equivalency of the claims are therefore to be embraces therein. 

1. A image display, comprising: a display panel; a chassis, which supports said display panel from a rear surface side thereof; a front surface-side cover, which is provided on a front side of said display panel; a rear surface-side cover, which is provided on a rear side of said display panel and is provided with openings in an upper portion and a lower portion thereof; an image display element connected at a lower end of said display panel; display driver substrates, which are connected at left end and right end of said display panel, and on a surface of which opposite to said chassis are provided circuit parts thereof; a power source substrate, which supplies driving power to said display driver substrates and said image display element, and on a surface of which opposite to said chassis are provided circuit parts thereof; first heat sinks, which are connected with said image display element; at least one (1) set of centrifugal fan, blow-off openings of which are provided in a direction towards said substrates, within a space surrounded by said display panel, said front surface-side cover and said rear surface-side cover; a first insulator board, which is provided at a position opposite to said display driver substrates and said power source substrate of said chassis; and a second insulator board, which is provided at a position opposite to said display driver substrates and said power source substrate on said rear surface-side cover.
 2. A image display, comprising: a display panel; a chassis, which supports said display panel from a rear surface side thereof; a front surface-side cover, which is provided on a front side of said display panel; a rear surface-side cover, which is provided on a rear side of said display panel and is provided with openings in an upper portion and a lower portion thereof; an image display element connected at a lower end of said display panel; display driver substrates, which are connected at left end and right end of said display panel, and on a surface of which opposite to said chassis are provided circuit parts thereof; a power source substrate, which supplies driving power to said display driver substrates and said image display element, and on a surface of which opposite to said chassis are provided circuit parts thereof; first heat sinks, which are connected with said image display element; at least one (1) set of centrifugal fan, blow-off openings of which are provided in a direction towards said substrates, within a space surrounded by said display panel, said front surface-side cover and said rear surface-side cover; a first insulator board, which is provided at a position opposite to said display driver substrates and said power source substrate of said chassis; and a second insulator board, which is provided at a position opposite to said display driver substrates and said power source substrate on said rear surface-side cover, wherein said opening in the lower portion is provided at a position opposite to said first heat sink, an upper side position of said opening in the lower portion is lower than said centrifugal fan, and is also higher than an upper side portion of said first heat sink, but within 5 mm, and a lower side position of said opening in the lower portion is at a position lower than a middle position of said first heat sink.
 3. The image display, as described in the claim 1, wherein said first insulator board is provided at a position opposite to an installation position of said circuit parts, having at least height equal to or higher than 50% with respect to a distance from said display driver substrates to said chassis, among said circuit parts which are mounted on said display driver substrates.
 4. The image display, as described in the claim 1, further comprising: a member, which is provided between said first insulator board and said chassis, and is high in thermal conductivity in an in-plane direction thereof, than said chassis.
 5. The image display, as described in the claim 1, wherein said second heat sink includes a plate-like heat sink, which is connected with an element among the circuit parts mounted on said power source substrate.
 6. The image display, as described in the claim 5, wherein height of said second heat sink in the direction towards said chassis is lower than height of the circuit parts mounted on said display driver substrates and said power source substrate in the direction towards said chassis.
 7. The image display, as described in the claim 5, wherein the plane portion of said second heat sink is provided nearly in parallel with the surface of said chassis.
 8. A image display, comprising: a display panel; a chassis, which supports said display panel from a rear surface side thereof; a front surface-side cover, which is provided on a front side of said display panel; a rear surface-side cover, which is provided on a rear side of said display panel; an image display element connected with said display panel; a display driver substrate, which is connected with said display panel, and on a surface of which opposite to said chassis are provided circuit parts thereof; a power source substrate, which supplies driving power to said display driver substrate and said image display element, and on a surface of which opposite to said chassis are provided circuit parts thereof; and a first insulator board, which is provided at a position opposite to said display driver substrates and said power source substrate of said chassis. 